About QPL

 

 

1982³â ⸳ÀÌ·¡ QPLÀº ¸®µåÇÁ·¹ÀÓ ºÐ¾ß¿¡¼­ ±Û·Î¹ú supplier·Î¼­ÀÇ ÀÔÁö¸¦ °ø°íÈ÷ ÇØ¿Ô½À´Ï´Ù. QPLÀº È«Äá¿¡ º»»ç¸¦ µÎ°í ÀÖÀ¸¸ç Áß±¹ °øÀå¿¡¼­ standard ¹× custom designed ¸®µåÇÁ·¹ÀÓ Á¦Ç°À» »ý»êÇØ ¿À°í ÀÖ½À´Ï´Ù. QPLÀÇ Á¦Ç° range´Â SOIC, QFP, TQFP, PDIP, PLCC and TSOPµîÀ» Æ÷ÇÔÇÏ°í ÀÖÀ¸¸ç, ²÷ÀÓ ¾ø´Â ÅõÀÚ¸¦ ÁøÇàÇÏ¿© pre-plated leadframes, NiPd, stiffeners for TBGA,and heatsinks for Thermal Enhanced PackagesµîÀÇ »õ·Î¿î ±â¼úÀ» È®º¸ÇØ ³ª°¡°í ÀÖ½À´Ï´Ù.

 

 

Product

 

 

Etched and Stamped Leadframes

   SOIC (Small Outline Integrated Circuit)

   QFP (Quad Flat Package)

   TQFP ( Thin Quad Flat Package)

   QFN (Quad Flat Non-Lead package)

   PDIP (Plastic Dual In-Line Package)

   PLCC (Plastic Leaded Chip Carrier)

   TBGA(Tape Ball Grid Array)

   TSOP (Thin Small Outline Package)

 

Application

 

 

Semiconductor