ѱ ݵü 1970 ܱ ݵü Assembly ڷ ۵Ǿ, ȭ 80 D-RAM ѱ ü ϸ鼭 ̷ Խϴ. Inc â̷ ݵü Assembly ǰ ںմϴ. Inc Ʈʵ ݵü о (flexible device substrates   Stamped and Etched Lead Frame) Ͽ ݵü ü鿡 ü񽺸 ϰ ֽϴ.

 

 

Polyimide Flexible Substrate for IC Packaging

 

ǰ

One Metal Layer/Two Metal Layer Tape Ball Grid Array

Micro Ball Grid Array

Chip on Film

Chip Scale Package

Flexible Printed Circuits

 

 

Partner

COMPASS

 

 

Stamped and Etched Lead Frame

ǰ

Etched and Stamped Leadframes

 SOIC (Small Outline Integrated Circuit)

 QFP (Quad Flat Package)

 TQFP ( Thin Quad Flat Package)

 QFN (Quad Flat Non-Lead package)

 PDIP (Plastic Dual In-Line Package)

 PLCC (Plastic Leaded Chip Carrier)

 TBGA (Tape Ball Grid Array)

 TSOP (Thin Small Outline Package)

 

 

Partner

QPL