About QPL



Founded in 1982, QPL Limited ( " QPL " ) with headquarters in Hong Kong and manufacturing operations in China,  is a global supplier of leadframes for the semiconductor industry. From leadframe design to delivery, QPL provides volume production while at the same time offering customers the customization they need for specific requirements. In addition to customer designs for both etched and stamped leadframes, QPL provides a comprehensive range of standard products including SOIC, QFP, TQFP, PDIP, PLCC and TSOP. QPL is also dedicating resources to licensing technologies (pre-plated leadframes, NiPd, stiffeners for TBGA,and heatsinks for Thermal Enhanced Packages, etc.).





Etched and Stamped Leadframes

   SOIC (Small Outline Integrated Circuit)

   QFP (Quad Flat Package)

   TQFP ( Thin Quad Flat Package)

   QFN (Quad Flat Non-Lead package)

   PDIP (Plastic Dual In-Line Package)

   PLCC (Plastic Leaded Chip Carrier)

   TBGA(Tape Ball Grid Array)

   TSOP (Thin Small Outline Package)